X28C010DI-25
vs
X28C010DM-25
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
INTERSIL CORP
Package Description
DIP, DIP32,.6
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
250 ns
250 ns
Command User Interface
NO
NO
Data Polling
YES
YES
JESD-30 Code
R-XDIP-T32
R-XDIP-T32
Memory Density
1048576 bit
1048576 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
128KX8
128KX8
Package Body Material
CERAMIC
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP32,.6
DIP32,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Page Size
256 words
256 words
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.0005 A
0.0005 A
Supply Current-Max
0.05 mA
0.05 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Toggle Bit
YES
YES
Base Number Matches
3
2
Part Package Code
DIP
Pin Count
32