X2816ADM
vs
DM5516AH-300/B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XICOR INC
SEEQ TECHNOLOGY INC
Package Description
DIP, DIP24,.6
DIP, DIP24,.6
Reach Compliance Code
unknown
unknown
Access Time-Max
300 ns
300 ns
Additional Feature
BYTE WRITE; OVER 100 YEARS DATA RETENTION
AUTOMATIC WRITE
Command User Interface
NO
NO
Data Polling
NO
YES
Data Retention Time-Min
100
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Length
32.07 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX8
2KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.6
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.72 mm
Standby Current-Max
0.04 A
Supply Current-Max
0.11 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
NMOS
NMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Toggle Bit
NO
NO
Width
15.24 mm
Base Number Matches
8
1
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.51
Endurance
100000 Write/Erase Cycles
Screening Level
38535Q/M;38534H;883B
Write Cycle Time-Max (tWC)
2 ms
Compare X2816ADM with alternatives
Compare DM5516AH-300/B with alternatives