X25F064S8I-5
vs
M28W160ECB70ZB1U
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XICOR INC
|
NUMONYX
|
| Package Description |
0.150 INCH, PLASTIC, SOIC-8
|
TFBGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
SPI SERIAL INTERFACE
|
BOTTOM BOOT BLOCK
|
| JESD-30 Code |
R-PDSO-G8
|
R-PBGA-B46
|
| Length |
4.9 mm
|
6.39 mm
|
| Memory Density |
65536 bit
|
16777216 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
46
|
| Number of Words |
8192 words
|
1048576 words
|
| Number of Words Code |
8000
|
1000000
|
| Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
8KX8
|
1MX16
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
SERIAL
|
PARALLEL
|
| Programming Voltage |
5 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
1.27 mm
|
0.75 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
3.9 mm
|
6.37 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
46
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
| Boot Block |
|
BOTTOM
|
| Type |
|
NOR TYPE
|
|
|
|
Compare X25F064S8I-5 with alternatives
Compare M28W160ECB70ZB1U with alternatives