X25650Z-2.7
vs
BU9880GUL-W
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
XICOR INC
|
ROHM CO LTD
|
Reach Compliance Code |
unknown
|
compliant
|
Clock Frequency-Max (fCLK) |
5 MHz
|
0.4 MHz
|
JESD-30 Code |
R-XBGA-B8
|
R-PBGA-B8
|
Memory Density |
65536 bit
|
65536 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
8192 words
|
8192 words
|
Number of Words Code |
8000
|
8000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
8KX8
|
8KX8
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
VFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Serial Bus Type |
SPI
|
I2C
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Write Cycle Time-Max (tWC) |
10 ms
|
5 ms
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
BGA
|
Package Description |
|
VFBGA,
|
Pin Count |
|
8
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.51
|
JESD-609 Code |
|
e1
|
Length |
|
1.98 mm
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Seated Height-Max |
|
0.55 mm
|
Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Pitch |
|
0.5 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
1.58 mm
|
|
|
|
Compare X25650Z-2.7 with alternatives
Compare BU9880GUL-W with alternatives