X25650Z-2.5
vs
M24C64-RCS3P/P
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XICOR INC
|
STMICROELECTRONICS
|
| Package Description |
XBGA-8
|
0.50 MM PITCH, ROHS COMPLIANT, WLCSP-8
|
| Reach Compliance Code |
unknown
|
compliant
|
| Additional Feature |
1 MILLION ENDURANCE CYCLES; 100 YEARS DATA RETENTION
|
|
| Clock Frequency-Max (fCLK) |
5 MHz
|
|
| Data Retention Time-Min |
100
|
|
| Endurance |
100000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PBGA-B8
|
R-XBCS-B8
|
| JESD-609 Code |
e0
|
|
| Length |
4.048 mm
|
1.805 mm
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
8KX8
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VBGA
|
CSP
|
| Package Equivalence Code |
BGA8,2X4,48/40
|
BGA8,3X5,44/25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.675 mm
|
0.635 mm
|
| Serial Bus Type |
SPI
|
I2C
|
| Standby Current-Max |
0.000001 A
|
|
| Supply Current-Max |
0.005 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
2.118 mm
|
1.4 mm
|
| Write Cycle Time-Max (tWC) |
10 ms
|
|
| Write Protection |
HARDWARE/SOFTWARE
|
HARDWARE
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
8
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
| I2C Control Byte |
|
1010DDDR
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare X25650Z-2.5 with alternatives
Compare M24C64-RCS3P/P with alternatives