X25256BI-2.5 vs X84256ZI-2.5 feature comparison

X25256BI-2.5 Xicor Inc

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X84256ZI-2.5 Xicor Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XICOR INC XICOR INC
Package Description XBGA-8 XBGA-8
Reach Compliance Code unknown unknown
Clock Frequency-Max (fCLK) 5 MHz
Data Retention Time-Min 100 100
Endurance 100000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 Code R-PBGA-B8 R-PBGA-B8
JESD-609 Code e0 e0
Length 3.8 mm
Memory Density 262144 bit 262144 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VBGA BGA
Package Equivalence Code BGA8,2X4,48/40 BGA8,2X4,48/40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE GRID ARRAY
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.763 mm
Serial Bus Type SPI I2C
Standby Current-Max 0.000001 A 0.000001 A
Supply Current-Max 0.005 mA 0.003 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 1.97 mm
Write Cycle Time-Max (tWC) 10 ms
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 2 1
Additional Feature 100000 ENDURANCE CYCLES; 10 YEARS DATA RETENTION; 64-BYTE PAGE

Compare X25256BI-2.5 with alternatives

Compare X84256ZI-2.5 with alternatives