X24C02DMB-2.7
vs
X24C02PM-2.7
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XICOR INC
|
IC MICROSYSTEMS SDN BHD
|
| Package Description |
HERMETIC SEALED, CERDIP-8
|
DIP, TSSOP8,.19
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
2 WIRE INTERFACE;PAGE WRITE
|
|
| Clock Frequency-Max (fCLK) |
0.1 MHz
|
0.1 MHz
|
| Data Retention Time-Min |
100
|
100
|
| Endurance |
100000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
| I2C Control Byte |
1010DDDR
|
1010DDDR
|
| JESD-30 Code |
R-GDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
2048 bit
|
2048 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
256 words
|
256 words
|
| Number of Words Code |
256
|
256
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
256X8
|
256X8
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
TSSOP8,.19
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
5.08 mm
|
4.07 mm
|
| Serial Bus Type |
I2C
|
I2C
|
| Standby Current-Max |
0.00005 A
|
0.00003 A
|
| Supply Current-Max |
0.002 mA
|
0.002 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Write Cycle Time-Max (tWC) |
10 ms
|
10 ms
|
| Write Protection |
HARDWARE
|
HARDWARE
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
8
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.32.00.51
|
| Length |
|
10.03 mm
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
240
|
|
|
|
Compare X24C02DMB-2.7 with alternatives
Compare X24C02PM-2.7 with alternatives