X24C00PIG-2.7
vs
X24C00PI-3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
IC MICROSYSTEMS SDN BHD
IC MICROSYSTEMS SDN BHD
Part Package Code
DIP
DIP
Package Description
ROHS COMPLIANT, PLASTIC, DIP-8
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
1 MHz
1 MHz
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
Length
10.03 mm
10.03 mm
Memory Density
128 bit
128 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
16 words
16 words
Number of Words Code
16
16
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16X8
16X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.32 mm
4.32 mm
Serial Bus Type
I2C
I2C
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Write Cycle Time-Max (tWC)
5 ms
5 ms
Base Number Matches
1
2
Data Retention Time-Min
100
Endurance
100000 Write/Erase Cycles
JESD-609 Code
e0
Moisture Sensitivity Level
3
Package Equivalence Code
DIP8,.3
Standby Current-Max
0.0001 A
Supply Current-Max
0.003 mA
Terminal Finish
TIN LEAD
Compare X24C00PIG-2.7 with alternatives
Compare X24C00PI-3 with alternatives