X24645SI
vs
X24645SIG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XICOR INC
IC MICROSYSTEMS SDN BHD
Package Description
PLASTIC, SOIC-14
SOP,
Reach Compliance Code
unknown
unknown
Additional Feature
2 WIRE SERIAL INTERFACE
Clock Frequency-Max (fCLK)
0.1 MHz
0.1 MHz
Data Retention Time-Min
100
Endurance
100000 Write/Erase Cycles
I2C Control Byte
DDMMMMMR
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e0
Length
8.65 mm
8.65 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
14
14
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8KX8
8KX8
Output Characteristics
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Serial Bus Type
I2C
I2C
Standby Current-Max
0.00005 A
Supply Current-Max
0.003 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.9 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
2
1
Part Package Code
SOIC
Pin Count
14
ECCN Code
EAR99
HTS Code
8542.32.00.51
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Compare X24645SI with alternatives
Compare X24645SIG with alternatives