X24645SI vs X24645SIG feature comparison

X24645SI Xicor Inc

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X24645SIG IC Microsystems Sdn Bhd

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XICOR INC IC MICROSYSTEMS SDN BHD
Package Description PLASTIC, SOIC-14 SOP,
Reach Compliance Code unknown unknown
Additional Feature 2 WIRE SERIAL INTERFACE
Clock Frequency-Max (fCLK) 0.1 MHz 0.1 MHz
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
I2C Control Byte DDMMMMMR
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0
Length 8.65 mm 8.65 mm
Memory Density 65536 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 14 14
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8KX8 8KX8
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Serial Bus Type I2C I2C
Standby Current-Max 0.00005 A
Supply Current-Max 0.003 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Write Protection HARDWARE/SOFTWARE
Base Number Matches 2 1
Part Package Code SOIC
Pin Count 14
ECCN Code EAR99
HTS Code 8542.32.00.51
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260

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