X24325VT1
vs
X25330V14IG-2.5
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XICOR INC
IC MICROSYSTEMS SDN BHD
Package Description
TSSOP-8
TSSOP,
Reach Compliance Code
unknown
unknown
Additional Feature
2 WIRE SERIAL INTERFACE
Clock Frequency-Max (fCLK)
0.1 MHz
5 MHz
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
5 mm
5 mm
Memory Density
32768 bit
32768 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
14
14
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
4KX8
4KX8
Output Characteristics
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Serial Bus Type
I2C
SPI
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
4.4 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
1
1
Rohs Code
Part Package Code
TSSOP
Pin Count
14
ECCN Code
EAR99
HTS Code
8542.32.00.51
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare X24325VT1 with alternatives
Compare X25330V14IG-2.5 with alternatives