X24257Z-2.5 vs M24256-BRCS6P/A feature comparison

X24257Z-2.5 IC Microsystems Sdn Bhd

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M24256-BRCS6P/A STMicroelectronics

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IC MICROSYSTEMS SDN BHD STMICROELECTRONICS
Part Package Code BGA BGA
Package Description BGA, 0.50 PITCH, ROHS COMPLIANT, WLCSP-8
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 0.4 MHz 0.4 MHz
JESD-30 Code R-PBGA-B8 R-PBGA-B8
Length 3.4798 mm 1.97 mm
Memory Density 262144 bit 262144 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 1.8 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Width 2 mm 1.785 mm
Write Cycle Time-Max (tWC) 10 ms 5 ms
Base Number Matches 2 1
Alternate Memory Width 1
Data Retention Time-Min 40
Endurance 1000000 Write/Erase Cycles
I2C Control Byte 1010DDDR
Package Equivalence Code BGA8,3X5,17/10
Seated Height-Max 0.65 mm
Standby Current-Max 0.000001 A
Supply Current-Max 0.005 mA
Terminal Pitch 0.5 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Write Protection HARDWARE

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