X24001SG-3
vs
X24001SM-2.7
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
No
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
IC MICROSYSTEMS SDN BHD
IC MICROSYSTEMS SDN BHD
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP, SOP8,.25
Pin Count
8
8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
1 MHz
1 MHz
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Length
5.9 mm
5.9 mm
Memory Density
128 bit
128 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
16 words
16 words
Number of Words Code
16
16
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
16X8
16X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Serial Bus Type
I2C
I2C
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9 mm
3.9 mm
Write Cycle Time-Max (tWC)
5 ms
5 ms
Base Number Matches
1
2
Data Retention Time-Min
100
JESD-609 Code
e0
Moisture Sensitivity Level
3
Package Equivalence Code
SOP8,.25
Standby Current-Max
0.00005 A
Supply Current-Max
0.001 mA
Terminal Finish
TIN LEAD
Compare X24001SG-3 with alternatives
Compare X24001SM-2.7 with alternatives