X22C12P
vs
S-22S12I10
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XICOR INC
|
SEIKO EPSON CORP
|
| Package Description |
0.300 INCH, PLASTIC, DIP-18
|
DIP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
150 ns
|
200 ns
|
| Additional Feature |
EEPROM SOFTWARE STORE/RECALL; RETENTION/ENDURANCE - 100 YEARS/100000 CYCLES
|
LG-MAX
|
| JESD-30 Code |
R-PDIP-T18
|
R-PDIP-T18
|
| JESD-609 Code |
e0
|
|
| Length |
22.975 mm
|
22 mm
|
| Memory Density |
1024 bit
|
1024 bit
|
| Memory IC Type |
NON-VOLATILE SRAM
|
NON-VOLATILE SRAM
|
| Memory Width |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
|
| Number of Terminals |
18
|
18
|
| Number of Words |
256 words
|
256 words
|
| Number of Words Code |
256
|
256
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
256X4
|
256X4
|
| Output Characteristics |
3-STATE
|
|
| Output Enable |
NO
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP18,.3
|
DIP18,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.7 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
3
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.41
|
|
|
|
Compare X22C12P with alternatives
Compare S-22S12I10 with alternatives