X2210DM/5
vs
CAT22C10LE-30
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
XICOR INC
ON SEMICONDUCTOR
Package Description
HERMETIC SEALED, CERDIP-18
DIP, DIP18,.3
Reach Compliance Code
unknown
compliant
Access Time-Max
300 ns
300 ns
JESD-30 Code
R-GDIP-T18
R-PDIP-T18
JESD-609 Code
e0
Memory Density
256 bit
256 bit
Memory IC Type
NON-VOLATILE SRAM
NON-VOLATILE SRAM
Memory Width
4
4
Number of Functions
1
1
Number of Terminals
18
18
Number of Words
64 words
64 words
Number of Words Code
64
64
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
64X4
64X4
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP18,.3
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Part Package Code
DIP
Pin Count
18
Length
21.97 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
5 V
Seated Height-Max
4.57 mm
Standby Current-Max
0.00003 A
Supply Current-Max
0.04 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Compare X2210DM/5 with alternatives
Compare CAT22C10LE-30 with alternatives