X20C05D-35 vs U630H04BSK25G1 feature comparison

X20C05D-35 Xicor Inc

Buy Now Datasheet

U630H04BSK25G1 Cypress Semiconductor

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XICOR INC SIMTEK CORP
Package Description HERMETIC SEALED, CERDIP-28 SOP,
Reach Compliance Code unknown unknown
Access Time-Max 35 ns 25 ns
Additional Feature DATA RETENTION 100 YEARS MINIMUM
JESD-30 Code R-GDIP-T28 R-PDSO-G24
JESD-609 Code e0 e3
Length 37.15 mm 15.4 mm
Memory Density 4096 bit 4096 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 28 24
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512X8 512X8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 7.24 mm 2.65 mm
Standby Current-Max 0.00025 A
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 15.24 mm 7.5 mm
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code SOIC
Pin Count 24
ECCN Code EAR99
HTS Code 8542.32.00.41
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare X20C05D-35 with alternatives

Compare U630H04BSK25G1 with alternatives