WV3HG264M72EEU403D4ISG
vs
MT18VDDT12872PHG-262XX
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICRON TECHNOLOGY INC
|
Part Package Code |
SODIMM
|
SODIMM
|
Package Description |
DIMM,
|
MO-224, SODIMM-200
|
Pin Count |
200
|
200
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.36
|
8542.32.00.36
|
Access Mode |
DUAL BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
Access Time-Max |
0.6 ns
|
0.75 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
JESD-30 Code |
R-XZMA-N200
|
R-XDMA-N200
|
JESD-609 Code |
e4
|
e4
|
Memory Density |
9663676416 bit
|
9663676416 bit
|
Memory IC Type |
DDR DRAM MODULE
|
DDR DRAM MODULE
|
Memory Width |
72
|
72
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
200
|
200
|
Number of Words |
134217728 words
|
134217728 words
|
Number of Words Code |
128000000
|
128000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Organization |
128MX72
|
128MX72
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIMM
|
DIMM
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Self Refresh |
YES
|
YES
|
Supply Voltage-Max (Vsup) |
1.9 V
|
2.7 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
2.3 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
2.5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
GOLD
|
GOLD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
ZIG-ZAG
|
DUAL
|
Base Number Matches |
2
|
1
|
Length |
|
67.5 mm
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Seated Height-Max |
|
8.13 mm
|
Temperature Grade |
|
COMMERCIAL
|
Width |
|
31.75 mm
|
|
|
|
Compare WV3HG264M72EEU403D4ISG with alternatives
Compare MT18VDDT12872PHG-262XX with alternatives