WSE128K16-35G2TI
vs
WSF128K16-37HM
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
WHITE MICROELECTRONICS
|
WHITE ELECTRONIC DESIGNS CORP
|
Package Description |
22.40 MM, CERAMIC, QFP-68
|
1.185 X 1.185 INCH, CERAMIC, HIP-66
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
JESD-30 Code |
S-CQFP-G68
|
S-CPGA-P66
|
Memory Density |
2097152 bit
|
2097152 bit
|
Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
66
|
Number of Words |
131072 words
|
131072 words
|
Number of Words Code |
128000
|
128000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Organization |
128KX16
|
128KX16
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
GULL WING
|
PIN/PEG
|
Terminal Position |
QUAD
|
PERPENDICULAR
|
Base Number Matches |
4
|
3
|
Rohs Code |
|
No
|
Access Time-Max |
|
70 ns
|
Additional Feature |
|
SRAM IS ORGANISED AS 128K X 16 OR 256K X 8; FLASH CAN ALSO BE ORGANISED AS 256K X 8
|
JESD-609 Code |
|
e4
|
Mixed Memory Type |
|
FLASH+SRAM
|
Package Code |
|
PGA
|
Package Equivalence Code |
|
PGA66,11X11
|
Standby Current-Max |
|
0.04 A
|
Supply Current-Max |
|
0.25 mA
|
Terminal Finish |
|
GOLD
|
Terminal Pitch |
|
2.54 mm
|
|
|
|