WS5901CYMB
vs
AM29C01/BQA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
WAFERSCALE INTEGRATION INC
ROCHESTER ELECTRONICS LLC
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Clock Frequency-Max
31.25 MHz
31.25 MHz
External Data Bus Width
4
4
JESD-30 Code
R-GDIP-T40
R-GDIP-T40
JESD-609 Code
e0
Number of Terminals
40
40
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Screening Level
38535Q/M;38534H;883B
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
BIT-SLICE MICROPROCESSOR
BIT-SLICE MICROPROCESSOR
Base Number Matches
1
2
Package Description
DIP,
Length
52.324 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
5.715 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
Compare WS5901CYMB with alternatives
Compare AM29C01/BQA with alternatives