WS57C49B-70DMB vs 27HC641L-70I/SJ feature comparison

WS57C49B-70DMB Waferscale Integration Inc

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27HC641L-70I/SJ Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WAFERSCALE INTEGRATION INC MICROCHIP TECHNOLOGY INC
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 70 ns 70 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Memory Density 65536 bit 65536 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Equivalence Code DIP24,.6 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.035 A 0.0001 A
Supply Current-Max 0.083 mA 0.121 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Part Package Code DIP
Package Description 0.300 INCH, SKINNY, CERDIP-24
Pin Count 24

Compare WS57C49B-70DMB with alternatives

Compare 27HC641L-70I/SJ with alternatives