WS57C49B-55T
vs
27HC641-55/J
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WAFERSCALE INTEGRATION INC
MICROCHIP TECHNOLOGY INC
Reach Compliance Code
unknown
unknown
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Memory Density
65536 bit
65536 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8KX8
8KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
WDIP
Package Equivalence Code
DIP24,.3
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.03 A
0.04 A
Supply Current-Max
0.095 mA
0.094 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Pbfree Code
Part Package Code
DIP
Package Description
WINDOWED, CERDIP-24
Pin Count
24
ECCN Code
EAR99
HTS Code
8542.32.00.61
Compare WS57C49B-55T with alternatives
Compare 27HC641-55/J with alternatives