WS57C49B-55FMB
vs
CY7C263-25TMB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WAFERSCALE INTEGRATION INC
CYPRESS SEMICONDUCTOR CORP
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
55 ns
25 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-CDFP-F24
R-GDFP-F24
JESD-609 Code
e0
e0
Memory Density
65536 bit
65536 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DFP
WDFP
Package Equivalence Code
FL24,.4
FL24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
MIL-STD-883
Standby Current-Max
0.035 A
0.05 A
Supply Current-Max
0.095 mA
0.14 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Part Package Code
DFP
Package Description
WINDOWED, CERPACK-24
Pin Count
24
Additional Feature
POWER SWITCHED PROM
Length
15.367 mm
Seated Height-Max
2.54 mm
Width
9.652 mm
Compare WS57C49B-55FMB with alternatives
Compare CY7C263-25TMB with alternatives