WS57C256F-35P vs 5962-9316603MXA feature comparison

WS57C256F-35P Waferscale Integration Inc

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5962-9316603MXA QP Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WAFERSCALE INTEGRATION INC QP SEMICONDUCTOR INC
Package Description 0.600 INCH, PLASTIC, DIP-28 DIP,
Reach Compliance Code unknown unknown
Access Time-Max 35 ns 35 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.75 V
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0002 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 3
Part Package Code DIP
Pin Count 28
ECCN Code EAR99
HTS Code 8542.32.00.71
Additional Feature POWER SWITCHED PROM
Length 37.0205 mm
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm
Width 7.62 mm

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