WS57C256F-35D vs TMS27PC256-100FML feature comparison

WS57C256F-35D Waferscale Integration Inc

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TMS27PC256-100FML Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WAFERSCALE INTEGRATION INC TEXAS INSTRUMENTS INC
Package Description 0.600 INCH, CERDIP-28 QCCJ, LDCC32,.5X.6
Reach Compliance Code unknown not_compliant
Access Time-Max 35 ns 100 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T28 R-PQCC-J32
JESD-609 Code e0
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP QCCJ
Package Equivalence Code DIP28,.6 LDCC32,.5X.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.5 V 13 V
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0005 A 0.00025 A
Supply Current-Max 0.164 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Base Number Matches 1 2
ECCN Code EAR99
HTS Code 8542.32.00.71
Length 13.97 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 3.56 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.43 mm

Compare WS57C256F-35D with alternatives

Compare TMS27PC256-100FML with alternatives