WS512K32N-17G2UCA vs 5962-9461116H9C feature comparison

WS512K32N-17G2UCA Microsemi Corporation

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5962-9461116H9C Microsemi Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code QFP QFP
Package Description QFP, QFP,
Pin Count 68 68
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 17 ns 17 ns
Additional Feature USER CONFIGURABLE AS 2M X 8
Alternate Memory Width 16
JESD-30 Code S-CQFP-G68 S-CQFP-G68
JESD-609 Code e0 e4
Length 22.36 mm 22.36 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 68 68
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 512KX32 512KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.51 mm 3.51 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm
Terminal Position QUAD QUAD
Width 22.36 mm 22.36 mm
Base Number Matches 3 4
Screening Level MIL-PRF-38534 Class H

Compare WS512K32N-17G2UCA with alternatives

Compare 5962-9461116H9C with alternatives