WS512K32F-85G4TI
vs
5962-9562402HNX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
WHITE ELECTRONIC DESIGNS CORP
MICROSEMI CORP
Reach Compliance Code
unknown
compliant
Access Time-Max
85 ns
100 ns
Additional Feature
CONFIGURABLE AS 512K X 32
CONFIGURABLE AS 2M X 8
Alternate Memory Width
8
16
JESD-30 Code
S-XQMA-F68
S-XQFP-F68
Memory Density
16777216 bit
16777216 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
16
32
Number of Functions
1
1
Number of Terminals
68
68
Number of Words
1048576 words
524288 words
Number of Words Code
1000000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
1MX16
512KX32
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
SQUARE
SQUARE
Package Style
MICROELECTRONIC ASSEMBLY
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
FLAT
FLAT
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
2
4
Part Package Code
QFP
Package Description
QFF,
Pin Count
68
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Length
39.625 mm
Package Code
QFF
Seated Height-Max
5.1 mm
Terminal Pitch
1.27 mm
Width
39.625 mm
Compare WS512K32F-85G4TI with alternatives
Compare 5962-9562402HNX with alternatives