WS512K32-70G4TCEA
vs
SYS82000FKXAI-70
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
WHITE ELECTRONIC DESIGNS CORP
MOSAIC SEMICONDUCTOR INC
Reach Compliance Code
unknown
unknown
Access Time-Max
70 ns
70 ns
Additional Feature
CONFIGURABLE AS 512K X 32 OR 1024K X 16
JESD-30 Code
S-CQMA-F68
R-PDIP-T36
JESD-609 Code
e0
Memory Density
16777216 bit
16777216 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
68
36
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2MX8
2MX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Shape
SQUARE
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
FLAT
THROUGH-HOLE
Terminal Position
QUAD
DUAL
Base Number Matches
4
2
Part Package Code
DIP
Package Description
,
Pin Count
36
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Package Code
DIP
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