WS512K32-55G2UQA vs PUMA68SV16000XB-012 feature comparison

WS512K32-55G2UQA Microsemi Corporation

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PUMA68SV16000XB-012 Mosaic Semiconductor Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MOSAIC SEMICONDUCTOR INC
Part Package Code QFP QMA
Package Description 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 ,
Pin Count 68 68
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 12 ns
Additional Feature USER CONFIGURABLE AS 2M X 8 CONFIGURABLE AS 2M X 8
Alternate Memory Width 16 16
JESD-30 Code S-CQFP-G68 S-PQMA-J68
Length 22.36 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 68 68
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 512KX32 512KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 3.51 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form GULL WING J BEND
Terminal Pitch 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 22.36 mm
Base Number Matches 1 1

Compare WS512K32-55G2UQA with alternatives

Compare PUMA68SV16000XB-012 with alternatives