WS512K32-120G4TQ
vs
SYS82000RKXL-12
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
APTA GROUP INC
|
Part Package Code |
QFP
|
SIP
|
Package Description |
CERAMIC, QFP-68
|
,
|
Pin Count |
68
|
36
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
120 ns
|
120 ns
|
Additional Feature |
USER CONFIGURABLE AS 512K X 32
|
|
Alternate Memory Width |
16
|
|
JESD-30 Code |
S-CQFP-F68
|
R-PSMA-T36
|
JESD-609 Code |
e4
|
|
Length |
39.6 mm
|
|
Memory Density |
16777216 bit
|
16777216 bit
|
Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
36
|
Number of Words |
2097152 words
|
2097152 words
|
Number of Words Code |
2000000
|
2000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
2MX8
|
2MX8
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
QFF
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK
|
MICROELECTRONIC ASSEMBLY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.56 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
|
Terminal Finish |
GOLD
|
|
Terminal Form |
FLAT
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
QUAD
|
SINGLE
|
Width |
39.6 mm
|
|
Base Number Matches |
4
|
2
|
|
|
|
Compare WS512K32-120G4TQ with alternatives
Compare SYS82000RKXL-12 with alternatives