WS27C256F-90CMB vs 27C256-90E/K feature comparison

WS27C256F-90CMB Waferscale Integration Inc

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27C256-90E/K Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WAFERSCALE INTEGRATION INC MICROCHIP TECHNOLOGY INC
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 90 ns 90 ns
I/O Type COMMON COMMON
JESD-30 Code R-CQCC-N32 R-CQCC-N32
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM CARD EPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN QCCN
Package Equivalence Code LCC32,.45X.55 LCC32,.45X.55
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.5 V 13 V
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Standby Current-Max 0.0005 A 0.0001 A
Supply Current-Max 0.078 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Base Number Matches 1 1
Pbfree Code No
Part Package Code QFJ
Package Description CERAMIC, LCC-32
Pin Count 32
Length 13.97 mm
Seated Height-Max 3.048 mm
Width 11.43 mm

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