WS27C256F-12DMB
vs
TD27C256-2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
WAFERSCALE INTEGRATION INC
ROCHESTER ELECTRONICS LLC
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
120 ns
120 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-XDIP-T28
JESD-609 Code
e0
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM CARD
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
Package Code
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12.5 V
12.75 V
Qualification Status
Not Qualified
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.00025 A
0.001 A
Supply Current-Max
0.065 mA
0.03 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Base Number Matches
1
4
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare WS27C256F-12DMB with alternatives
Compare TD27C256-2 with alternatives