WS27C010L-90DMB
vs
AM27H010-90DE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WAFERSCALE INTEGRATION INC
ADVANCED MICRO DEVICES INC
Package Description
CERDIP-32
WDIP, DIP32,.6
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
90 ns
90 ns
JESD-30 Code
R-GDIP-T32
R-GDIP-T32
Memory Density
1048576 bit
1048576 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
WDIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Supply Current-Max
0.05 mA
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Rohs Code
No
Part Package Code
DIP
Pin Count
32
I/O Type
COMMON
JESD-609 Code
e0
Length
42.1005 mm
Package Equivalence Code
DIP32,.6
Seated Height-Max
5.588 mm
Standby Current-Max
0.035 A
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare WS27C010L-90DMB with alternatives
Compare AM27H010-90DE with alternatives