WS27C010L-90DMB vs AM27H010-90DE feature comparison

WS27C010L-90DMB Waferscale Integration Inc

Buy Now Datasheet

AM27H010-90DE AMD

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WAFERSCALE INTEGRATION INC ADVANCED MICRO DEVICES INC
Package Description CERDIP-32 WDIP, DIP32,.6
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 90 ns 90 ns
JESD-30 Code R-GDIP-T32 R-GDIP-T32
Memory Density 1048576 bit 1048576 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Supply Current-Max 0.05 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 2
Rohs Code No
Part Package Code DIP
Pin Count 32
I/O Type COMMON
JESD-609 Code e0
Length 42.1005 mm
Package Equivalence Code DIP32,.6
Seated Height-Max 5.588 mm
Standby Current-Max 0.035 A
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare WS27C010L-90DMB with alternatives

Compare AM27H010-90DE with alternatives