WS128K32-15H1I
vs
5962-3829411MYX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WHITE ELECTRONIC DESIGNS CORP
CYPRESS SEMICONDUCTOR CORP
Package Description
1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
QCCN,
Reach Compliance Code
unknown
unknown
Access Time-Max
15 ns
45 ns
Additional Feature
USER CONFIGURABLE AS 512K X 8
Alternate Memory Width
16
JESD-30 Code
S-CPGA-P66
R-CQCC-N32
Length
27.3 mm
13.97 mm
Memory Density
4194304 bit
65536 bit
Memory IC Type
SRAM MODULE
STANDARD SRAM
Memory Width
32
8
Number of Functions
1
1
Number of Terminals
66
32
Number of Words
131072 words
8192 words
Number of Words Code
128000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
128KX32
8KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
QCCN
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.34 mm
2.49 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
PIN/PEG
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
PERPENDICULAR
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
27.3 mm
11.43 mm
Base Number Matches
2
1
Part Package Code
QFJ
Pin Count
32
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Screening Level
MIL-STD-883
Compare WS128K32-15H1I with alternatives
Compare 5962-3829411MYX with alternatives