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WR12X563JT vs SG73P2BLTE563J feature comparison

WR12X563JT Walsin Technology Corporation

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SG73P2BLTE563J KOA Speer Electronics Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WALSIN TECHNOLOGY CORP KOA SPEER ELECTRONICS INC
Package Description CHIP CHIP
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature LASER TRIMMABLE
Construction Chip Chip
JESD-609 Code e0 e0
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.6 mm
Package Length 3.1 mm 3.2 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.6 mm 1.6 mm
Packing Method TR, PAPER, 7 INCH TR, PUNCHED PLASTIC, 7 INCH
Rated Power Dissipation (P) 0.25 W 0.33 W
Rated Temperature 70 °C 70 °C
Resistance 56000 Ω 56000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 5% 5%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

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