WMS512K8-L25DJI
vs
EDI88512LPA25RJBG
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP-PMG MICROELECTRONICS
|
| Part Package Code |
SOJ
|
SOJ
|
| Package Description |
SOJ,
|
SOJ,
|
| Pin Count |
36
|
36
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
25 ns
|
25 ns
|
| JESD-30 Code |
R-CDSO-J36
|
R-PDSO-J36
|
| JESD-609 Code |
e4
|
|
| Length |
23.37 mm
|
23.495 mm
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
36
|
36
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Organization |
512KX8
|
512KX8
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
SOJ
|
SOJ
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
225
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.6736 mm
|
3.7592 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
GOLD
|
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
11.23 mm
|
10.16 mm
|
| Base Number Matches |
1
|
2
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare WMS512K8-L25DJI with alternatives
Compare EDI88512LPA25RJBG with alternatives