WMS512K8-85CC
vs
WS512K8-85CMEA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
WHITE ELECTRONIC DESIGNS CORP
Part Package Code
DIP
Package Description
0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
SIDE BRAZED, CERAMIC, DIP-32
Pin Count
32
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
85 ns
85 ns
JESD-30 Code
R-CDIP-T32
R-CDMA-T32
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
512KX8
512KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.13 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.5 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
4
Rohs Code
JESD-609 Code
e0
Terminal Finish
TIN LEAD
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