WMS128K8C-20DEIE vs EDI88128CS20CC feature comparison

WMS128K8C-20DEIE White Electronic Designs Corp

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EDI88128CS20CC Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP MICROSEMI CORP
Package Description CERAMIC, SOJ-32 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Reach Compliance Code unknown unknown
Access Time-Max 20 ns 20 ns
I/O Type COMMON
JESD-30 Code R-CDSO-J32 R-CDIP-T32
JESD-609 Code e0
Length 21.1 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code SOJ DIP
Package Equivalence Code SOJ32,.44
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.96 mm
Standby Current-Max 0.015 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.13 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Width 11.3 mm 10.16 mm
Base Number Matches 2 5
Pbfree Code No
Part Package Code DIP
Pin Count 32
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare WMS128K8C-20DEIE with alternatives

Compare EDI88128CS20CC with alternatives