WMF512K8X-70CI5
vs
5962-9669204HXA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
AEROFLEX MICROELECTRONIC SOLUTIONS
Part Package Code
DIP
Package Description
DIP,
Pin Count
32
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-CDIP-T32
R-XDIP-T32
Memory Density
4194304 bit
4194304 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
Number of Terminals
32
32
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
512KX8
512KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.13 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.5 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
4
6
Command User Interface
NO
Data Polling
YES
Number of Sectors/Size
8
Package Equivalence Code
DIP32,.6
Screening Level
38535Q/M;38534H;883B
Sector Size
64K
Standby Current-Max
0.0016 A
Supply Current-Max
0.05 mA
Toggle Bit
NO
Type
NOR TYPE