WF512K32N-60H1M5A vs WF512K32F-150HI5 feature comparison

WF512K32N-60H1M5A Microsemi Corporation

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WF512K32F-150HI5 White Microelectronics

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP WHITE MICROELECTRONICS
Part Package Code PGA
Package Description 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Pin Count 66
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 60 ns 150 ns
Additional Feature USER CONFIGURABLE AS 2M X 8 USER CONFIGURABLE AS 2M X 8
Alternate Memory Width 16 16
JESD-30 Code S-CPGA-P66 S-XHIP-P66
Length 27.3 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH MODULE FLASH MODULE
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 66 66
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 512KX32 512KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package Code PGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.6 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR HEX
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE NOR TYPE
Width 27.3 mm
Base Number Matches 4 1
Output Characteristics 3-STATE

Compare WF512K32N-60H1M5A with alternatives

Compare WF512K32F-150HI5 with alternatives