WF10U1820BVLQ
vs
RP73F2E182RBTDF
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
WALSIN TECHNOLOGY CORP
TE CONNECTIVITY LTD
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Additional Feature
HIGH PRECISION
HIGH PRECISION
Construction
Rectangular
Chip
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.55 mm
Package Length
3.1 mm
3.1 mm
Package Style
SMT
SMT
Package Width
2.6 mm
2.4 mm
Packing Method
TR, PAPER, 7 INCH
TR, PAPER, 7 INCH
Rated Power Dissipation (P)
0.25 W
0.3 W
Rated Temperature
70 °C
70 °C
Reference Standard
AEC-Q200
MIL-STD-202
Resistance
182 Ω
182 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1210
1210
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
25 ppm/°C
25 ppm/°C
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.1%
0.1%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Package Shape
RECTANGULAR PACKAGE
Compare WF10U1820BVLQ with alternatives
Compare RP73F2E182RBTDF with alternatives