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WF10T1150BVLQ vs RP73G2E115RBTDF feature comparison

WF10T1150BVLQ Walsin Technology Corporation

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RP73G2E115RBTDF TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer WALSIN TECHNOLOGY CORP TE CONNECTIVITY LTD
Package Description CHIP CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature HIGH PRECISION HIGH PRECISION
Construction Rectangular Chip
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.1 mm 3.1 mm
Package Style SMT SMT
Package Width 2.6 mm 2.4 mm
Packing Method TR, PAPER, 7 INCH TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.25 W 0.3 W
Rated Temperature 70 °C 70 °C
Reference Standard AEC-Q200 MIL-STD-202
Resistance 115 Ω 115 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1210 1210
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 50 ppm/°C 50 ppm/°C
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.1% 0.1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Package Shape RECTANGULAR PACKAGE
Resistors » Thin Film Resistors
Resistors » Thin Film Resistors

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Compare RP73G2E115RBTDF with alternatives