WED3DG728V75D1 vs HB52D88DC-B6F feature comparison

WED3DG728V75D1 Microsemi Corporation

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HB52D88DC-B6F Hitachi Ltd

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP HITACHI LTD
Part Package Code SODIMM MODULE
Package Description DIMM, DIMM,
Pin Count 144 144
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.02
Access Mode FOUR BANK PAGE BURST DUAL BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH; WD-MAX; SEATED HGT-NOM
JESD-30 Code R-XZMA-N144 R-XDMA-N144
Memory Density 603979776 bit 67108864 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
Memory Width 72 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 65 °C
Operating Temperature-Min
Organization 8MX72 8MX8
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Self Refresh YES YES
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position ZIG-ZAG DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 3 2
Access Time-Max 6 ns
Length 67.6 mm
Seated Height-Max 31.75 mm
Terminal Pitch 0.8 mm
Width 3.8 mm

Compare WED3DG728V75D1 with alternatives

Compare HB52D88DC-B6F with alternatives