WED3DG6316V7D2I
vs
KMM364C1680CS-6
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code |
DIMM
|
|
Package Description |
,
|
DIMM, DIMM168
|
Pin Count |
168
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.32
|
8542.32.00.32
|
Access Mode |
FOUR BANK PAGE BURST
|
FAST PAGE
|
Additional Feature |
AUTO/SELF REFRESH
|
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
|
JESD-30 Code |
R-XDMA-N168
|
R-XDMA-N168
|
Memory Density |
1073741824 bit
|
1073741824 bit
|
Memory IC Type |
SYNCHRONOUS DRAM MODULE
|
FAST PAGE DRAM MODULE
|
Memory Width |
64
|
64
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
168
|
168
|
Number of Words |
16777216 words
|
16777216 words
|
Number of Words Code |
16000000
|
16000000
|
Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
16MX64
|
16MX64
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Self Refresh |
YES
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
1
|
Access Time-Max |
|
60 ns
|
I/O Type |
|
COMMON
|
Output Characteristics |
|
3-STATE
|
Package Code |
|
DIMM
|
Package Equivalence Code |
|
DIMM168
|
Refresh Cycles |
|
8192
|
Standby Current-Max |
|
0.03 A
|
Supply Current-Max |
|
1.76 mA
|
Terminal Pitch |
|
1.27 mm
|
|
|
|
Compare WED3DG6316V7D2I with alternatives
Compare KMM364C1680CS-6 with alternatives