WED3DG6316V7D2I vs KMM364C1680CS-6 feature comparison

WED3DG6316V7D2I Microsemi Corporation

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KMM364C1680CS-6 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code DIMM
Package Description , DIMM, DIMM168
Pin Count 168
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode FOUR BANK PAGE BURST FAST PAGE
Additional Feature AUTO/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 Code R-XDMA-N168 R-XDMA-N168
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type SYNCHRONOUS DRAM MODULE FAST PAGE DRAM MODULE
Memory Width 64 64
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 168 168
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 16MX64 16MX64
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Self Refresh YES
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position DUAL DUAL
Base Number Matches 2 1
Access Time-Max 60 ns
I/O Type COMMON
Output Characteristics 3-STATE
Package Code DIMM
Package Equivalence Code DIMM168
Refresh Cycles 8192
Standby Current-Max 0.03 A
Supply Current-Max 1.76 mA
Terminal Pitch 1.27 mm

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