WED3C7410E16M-400BM
vs
MC9328MXLVP20
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP-PMG MICROELECTRONICS
|
MOTOROLA INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
21 X 25 MM, CERAMIC, BGA-225
|
LFBGA, BGA225,15X15,32
|
Pin Count |
225
|
225
|
Reach Compliance Code |
unknown
|
unknown
|
Address Bus Width |
32
|
25
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
133 MHz
|
16 MHz
|
External Data Bus Width |
64
|
32
|
Format |
FLOATING POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
R-CBGA-B225
|
S-PBGA-B225
|
Low Power Mode |
NO
|
YES
|
Number of Terminals |
225
|
225
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LFBGA
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Speed |
400 MHz
|
200 MHz
|
Supply Voltage-Max |
1.9 V
|
2 V
|
Supply Voltage-Min |
1.7 V
|
1.8 V
|
Supply Voltage-Nom |
1.8 V
|
1.9 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
4
|
HTS Code |
|
8542.31.00.01
|
Bit Size |
|
32
|
Length |
|
13 mm
|
Package Equivalence Code |
|
BGA225,15X15,32
|
Seated Height-Max |
|
1.6 mm
|
Technology |
|
CMOS
|
Terminal Pitch |
|
0.8 mm
|
Width |
|
13 mm
|
|
|
|
Compare WED3C7410E16M-400BM with alternatives
Compare MC9328MXLVP20 with alternatives