WED2ZL361MS35BI
vs
GS8322ZV36B-133
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
GSI TECHNOLOGY
|
Package Description |
PLASTIC, BGA-119
|
BGA,
|
Reach Compliance Code |
unknown
|
compliant
|
Access Time-Max |
3.5 ns
|
8.5 ns
|
Additional Feature |
PIPELINED ARCHITECTURE
|
PIPELINED OR FLOW-THROUGH ARCHITECTURE
|
JESD-30 Code |
R-PBGA-B119
|
R-PBGA-B119
|
Length |
23 mm
|
22 mm
|
Memory Density |
37748736 bit
|
37748736 bit
|
Memory IC Type |
ZBT SRAM
|
ZBT SRAM
|
Memory Width |
36
|
36
|
Number of Functions |
1
|
1
|
Number of Terminals |
119
|
119
|
Number of Words |
1048576 words
|
1048576 words
|
Number of Words Code |
1000000
|
1000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
1MX36
|
1MX36
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
220
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.79 mm
|
1.99 mm
|
Supply Voltage-Max (Vsup) |
2.625 V
|
2 V
|
Supply Voltage-Min (Vsup) |
2.375 V
|
1.6 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
17 mm
|
14 mm
|
Base Number Matches |
1
|
4
|
Pbfree Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
119
|
ECCN Code |
|
3A991.B.2.A
|
HTS Code |
|
8542.32.00.41
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare WED2ZL361MS35BI with alternatives
Compare GS8322ZV36B-133 with alternatives