WED2ZL361MS35BI vs GS8322ZV36B-133 feature comparison

WED2ZL361MS35BI White Electronic Designs Corp

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GS8322ZV36B-133 GSI Technology

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP GSI TECHNOLOGY
Package Description PLASTIC, BGA-119 BGA,
Reach Compliance Code unknown compliant
Access Time-Max 3.5 ns 8.5 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED OR FLOW-THROUGH ARCHITECTURE
JESD-30 Code R-PBGA-B119 R-PBGA-B119
Length 23 mm 22 mm
Memory Density 37748736 bit 37748736 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1MX36 1MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.79 mm 1.99 mm
Supply Voltage-Max (Vsup) 2.625 V 2 V
Supply Voltage-Min (Vsup) 2.375 V 1.6 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 17 mm 14 mm
Base Number Matches 1 4
Pbfree Code No
Part Package Code BGA
Pin Count 119
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
JESD-609 Code e0
Moisture Sensitivity Level 3
Terminal Finish TIN LEAD

Compare WED2ZL361MS35BI with alternatives

Compare GS8322ZV36B-133 with alternatives