WE128K32N200H1IA
vs
WE128K32P200H1IA
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
WHITE ELECTRONIC DESIGNS CORP
|
| Package Description |
1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.1.B.1
|
3A991.B.1.B.1
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
200 ns
|
200 ns
|
| Additional Feature |
ALSO CONFIGURABLE AS 512K X 8
|
ALSO CONFIGURABLE AS 512K X 8
|
| Alternate Memory Width |
16
|
16
|
| JESD-30 Code |
S-CPGA-P66
|
S-CPGA-P66
|
| Length |
27.3 mm
|
27.3 mm
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
EEPROM MODULE
|
EEPROM MODULE
|
| Memory Width |
32
|
32
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
66
|
66
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
128KX32
|
128KX32
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
PGA
|
PGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.6 mm
|
4.6 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
| Width |
27.3 mm
|
27.3 mm
|
| Write Cycle Time-Max (tWC) |
10 ms
|
10 ms
|
| Base Number Matches |
2
|
2
|
|
|
|