WC64P603EV-66Q3M
vs
MPC603EFE266TX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
WHITE MICROELECTRONICS
FREESCALE SEMICONDUCTOR INC
Package Description
HERMETIC SEALED, CERAMIC, QFP-240
FQFP,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.67 MHz
66.67 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CQFP-G240
S-CQFP-G240
Low Power Mode
YES
YES
Number of Terminals
240
240
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFP
FQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Speed
66.6 MHz
266 MHz
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Form
GULL WING
GULL WING
Terminal Position
QUAD
QUAD
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Part Package Code
QFP
Pin Count
240
Length
31.305 mm
Seated Height-Max
4.15 mm
Terminal Pitch
0.5 mm
Width
31.305 mm
Compare WC64P603EV-66Q3M with alternatives
Compare MPC603EFE266TX with alternatives