W948V6KBHX5I vs M53D2561616A-5BG2F feature comparison

W948V6KBHX5I Winbond Electronics Corp

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M53D2561616A-5BG2F Elite Semiconductor Memory Technology Inc

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Rohs Code Yes
Part Life Cycle Code Not Recommended Contact Manufacturer
Ihs Manufacturer WINBOND ELECTRONICS CORP ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC
Package Description TFBGA, TFBGA,
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.24 8542.32.00.24
Date Of Intro 2017-08-29
Samacsys Manufacturer Winbond
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 5 ns 5 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B60 R-PBGA-B60
Length 9 mm 13 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type LPDDR1 DRAM DDR DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 60 60
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 16MX16 16MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.025 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8 mm 8 mm
Base Number Matches 1 1

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Compare M53D2561616A-5BG2F with alternatives