W72M64VB70BM
vs
W72M64VB90BM
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
BGA
BGA
Package Description
BGA, BGA159,10X16,50
BGA,
Pin Count
159
159
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
70 ns
Boot Block
BOTTOM
Command User Interface
NO
Data Polling
YES
JESD-30 Code
R-PBGA-B159
R-PBGA-B159
Memory Density
134217728 bit
268435456 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
64
64
Number of Sectors/Size
8,64
Number of Terminals
159
159
Number of Words
2097152 words
4194304 words
Number of Words Code
2000000
4000000
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2MX64
4MX64
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA159,10X16,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Sector Size
4K,32K
Standby Current-Max
0.000021 A
Supply Current-Max
0.14 mA
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
Type
NOR TYPE
Write Protection
HARDWARE
Base Number Matches
2
2
Rohs Code
Number of Functions
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare W72M64VB70BM with alternatives
Compare W72M64VB90BM with alternatives