W3E64M16S-266NBC vs MT47J64M16HQ-25E:E feature comparison

W3E64M16S-266NBC Microsemi Corporation

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MT47J64M16HQ-25E:E Micron Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LBGA, 8 X 11.50 MM, ROHS COMPLIANT, FBGA-60
Pin Count 60 60
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode FOUR BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 0.75 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B60 R-PBGA-B60
Length 12.5 mm 11.5 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type DDR DRAM DDR2 DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 60 60
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64MX16 64MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 2.7 V 1.625 V
Supply Voltage-Min (Vsup) 2.3 V 1.425 V
Supply Voltage-Nom (Vsup) 2.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 10 mm 8 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER

Compare W3E64M16S-266NBC with alternatives

Compare MT47J64M16HQ-25E:E with alternatives