W3E64M16S-266NBC
vs
K4X1G163PC-FEC30
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
LBGA,
VFBGA, BGA60,9X10,32
Pin Count
60
60
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.75 ns
6 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
Length
12.5 mm
11.5 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
DDR DRAM
DDR1 DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-25 °C
Organization
64MX16
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
2.7 V
1.95 V
Supply Voltage-Min (Vsup)
2.3 V
1.7 V
Supply Voltage-Nom (Vsup)
2.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
10 mm
11 mm
Base Number Matches
2
1
Rohs Code
Clock Frequency-Max (fCLK)
133 MHz
I/O Type
COMMON
Interleaved Burst Length
2,4,8,16
Output Characteristics
3-STATE
Package Equivalence Code
BGA60,9X10,32
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Refresh Cycles
8192
Sequential Burst Length
2,4,8,16
Standby Current-Max
0.000025 A
Supply Current-Max
0.135 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare W3E64M16S-266NBC with alternatives
Compare K4X1G163PC-FEC30 with alternatives